Keynote Speaker

Rapid Production of Next-Generation Semi Technologies: Accelerated Time-to-Market and Advanced Integration with High-Productivity Direct-Write E-Beam Litho

Ken MacWilliams (Multibeam Corporation,United States of America)

Biography

Dr. MacWilliams brings decades of experience in semiconductor device, process and equipment innovations. He joined Multibeam in 2020 to help productize the world’s first cost-effective direct write lithography system. Dr. MacWilliams has launched multiple novel equipment platforms and processes with the world’s leading semiconductor manufacturers. He is an NSF Fellow with over 100 publications and more than a dozen patents.

Ken MacWilliams is President and board member of Multibeam Corporation, Santa Clara, CA. He has helped develop and commercialize novel equipment platforms and processes for the world’s leading semiconductor manufacturers, and held senior management positions at Applied Materials, Novellus Systems (acquired by Lam Research), Veeco, and Yield Engineering Systems (YES). He holds PhD and MS Electrical Engineering degrees from Stanford University.