Keynote & Invited Speakers

Keynote Speakers


Please click the photo below to check the biography of each keynote speakers
Session 1
Martin van den Brink

The Battle between Exponential Functions: AI, Supercomputers, Chips and Litho Scaling

Martin van den Brink (ASML, Former President & CTO, Netherlands)
Session 2
Mizuki Sakamoto

Contribution of Fusion Energy to Energy Sustainability and Productivity

Mizuki Sakamoto (University of Tsukuba, Japan)
Session 6
Ken MacWilliams

Rapid Production of Next-Generation Semi Technologies: Accelerated Time-to-Market and Advanced Integration with High-Productivity Direct-Write E-Beam Litho

Ken MacWilliams (Multibeam Corporation, U.S.A)
Session 13
David Britz

Living at the Edge: Shaping the Future of Edge AI with Applied Materials

David Britz (Applied Materials, U.S.A)

Invited speakers

Session 1
Exploring Innovative Absorber Materials for EUV Masks Kazunori Seki (Tekscend Photomask Corp.(Japan）

Session 3
Manufacturing Transformation Era: Process Solution Technologies for Panel-Level Packaging Based on Wafer-Level QualityRyoya Kitazawa (ULVAC.Inc, Japan)

Manufacturing processes, photomasks, and panel specification requirements for ultra-high PPI VR displays on glass substrates Charles Annis (Omedia, Japan）

Session 4
13th eBeam Initiative Annual Luminaries Survey Predicts Photomask Market and Equipment Growth Aki Fujimura (D2S,Inc, U.S.A)

Session 5
Revealing High-NA Mask Phase-Effects by AIMS(R) EUV Metrology Matthias Roesch (Carl Zeiss SMT GmbH, Germany)

Session 6
Update on eBeam Multigon Format Optimizations Kokoro Kato (Synopsys, Japan)

Session 7
Latest developments on CNT pellicles for high power EUV lithography Takeshi Kondo (LINTEC OF AMERICA, INC., Japan)

Session 9
History and future outlook for advanced EB resist development Kei Yamamoto (FUJIFILM Corporation, Japan)

Session 10
Intel is paving the way to State-of-the-art Anamorphic High-NA EUV Mask Manufacturing and Lithography Safak Sayan (Intel Corporation, U.S.A)

Session 11
Advanced Mastering Technology enabling future Optical Designs Bríd Connolly (Tekscend Photomask Company, Germany)

Metastructures and the Advanced Mask Pipeline: Unlocking the Future of AR Bo Zhao (Meta, U.S.A)

Session 13
Semiconductor photomask technology and mask writer market Vishal Saroha (Yole Group, France)

Session 14
Model for EUV Multilayers:Quantified Intermixing via the Effective Medium Approximation Seulki Roh (Samsung Electronics Co.,Ltd., Republic of Korea)

New EUV mask and blanks for DRAM 1a nm and beyond Hiroshi Hanakawa (AGC Inc., Japan)

Reducing Overlay Impact On High Power EUV Scanners Through Optimizing Reticle Substrate Thermal Properties Rick Jansen (ASML Netherlands B.V., Netherlands)

Session 15
Stitching at resolution for High NA: an experimental process window study Lieve Van Look (Imec, Belgium)

Session 17
Latest Advances in Multi-Beam Mask-Writing Christoph Spengler (IMS Nanofabrication GmbH, Austria)


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